TYAN Coprocessor Platforms

  • OpenPOWER System
  • GPU Computing Platforms
  • HPC Platforms
  • Cloud Platforms
  • Embedded Platforms
  • SMB Platforms
  • AMD Open 3.0

 

TYAN Xeon Phi™ Validated Coprocessor Platforms:

  8-Xeon Phi 4-Xeon Phi 3-Xeon Phi 2-Xeon Phi
7120P B7079F77CV10HR-X!
B7079F77CV10HR-2T-X!
B7059F77BV10R-X
B7059F77BV10R-2T-X
B7071T80V8HR-X
B7071T80V8HR-2T-X
B7061T77W8HR^
B7081G80V4HR-X%
B7081G80V4HR-2T-X%
B7081G80V4HR-X^
B7081G80V4HR-2T-X^
B7061G80W4H^
5110P B7079F77CV10HR-X
B7079F77CV10HR-2T-X
B7059F77BV10R-X
B7059F77BV10R-2T-X
B7071T80V8HR-X
B7071T80V8HR-2T-X
B7061T77W8HR
B7081G80V4HR-X
B7081G80V4HR-2T-X
B7061G80W4H
3120P B7079F77CV10HR-X!
B7079F77CV10HR-2T-X!
B7059F77BV10R-X
B7059F77BV10R-2T-X
B7071T80V8HR-X
B7071T80V8HR-2T-X
B7061T77W8HR^
B7081G80V4HR-X%
B7081G80V4HR-2T-X%
B7081G80V4HR-X^
B7081G80V4HR-2T-X^
B7061G80W4H^
^ = Max. system ambient temperature is 25-degree C when Coprocessor modules are fully populated
% = Max. system ambient temperature is 22-degree C when Coprocessor modules are fully populated
! = HDDs are not fully populated
# = May have no power redundancy when GPUs are fully populated in the system

 

TYAN Intel Xeon Phi Platforms

FT76-B7922

Intel Xeon Phi Server

FT76-B7922: 4U/4-Coprocessor Platform

  • Support (4) Intel® Xeon® E7-8800/E7-4800 v3 Series Processor
  • Quad Socket R1 / Intel® C602-J chipset
  • 96 DDR4 DIMM slots (Via 8x Memory Risers)
  • (2)10GbE or (4)10GbE + (1) IPMI
  • (4) PCI-E Gen.3 x16* + (1) PCI-E Gen.3 x8 + (2) PCI-E Gen.3 x8Mezz. + (2) hot-swap PCI-E Gen.3 x8 slots (-HE SKU)
    * Support (4) Intel® Xeon® Phi co-processor
  • (8) 2.5" hot-swap HDD   [Details...]

TA80-B7071

Intel Xeon Phi Server

TA80-B7071: 2U/4-Coprocessor Platform

  • Support (2) Intel® Xeon® E5-2600 v3/v4 Processors
  • LGA2011 Dual Sockets / Intel® C612 chipset
  • (8+8) DIMM slots
  • (2)10GbE/GbE + (1)IPMI
  • (4) PCI-E Gen.3x16* + (1) PCI-E Gen.3x8
    * Support (4) Intel® Xeon® Phi co-processor
  • (8) hot-swap 2.5" + (2) int. 2.5" HDD   [Details...]

GA80-B7081

Intel Xeon Phi Server

GA80-B7081:
1U Server compatible Xeon Phi™ 5110P

  • Support Intel® Xeon® Processor E5-2600 v3/v4 Series
  • LGA2011 Dual Sockets / Intel® C612 chipset
  • (8)+(8) DIMM slots, (4) 2.5" Hot-Swap HDD, (3) LAN ports
  • (3) PCI-E Gen3 x16 slots for Xeon Phi™ 5110P   [Details...]

FT77C-B7079

Intel Xeon Phi Server

FT77C-B7079:
4U Server compatible Xeon Phi™ 7120P

  • Support Intel® Xeon® Processor E5-2600 v3/v4 Series
  • LGA2011 Dual Sockets / Intel® C612 chipset
  • (12)+(12) DIMM slots, (10) 3.5"/2.5" Hot-Swap HDD, (2) LAN ports
  • (8) PCI-E Gen3 x16 slots for Xeon Phi™ 7120P   [Details...]

S7070

Server / Workstation Board

S7070 (SSI EEB):
Dual-socket board for mainstream applications

  • Support (2) Intel® Xeon® E5-2600 v3/v4 processors
  • LGA2011 Dual Sockets / Intel® C612 chipset
  • (1) PCI-E Gen.3 x8 slot, (3)PCI-E Gen.3 x16 slots
  • (2) 1000BASE-T ports with shared IPMI   [Details...]

S5620

Server Board

S5620 (ATX):
Single-socket board for CSP deployment

  • Support (1) Intel® Xeon® E5-2600 v3/v4 or E5-1600 v3 series processors
  • LGA2011 Single Socket / Intel® C612 chipset
  • (8) DDR4 DIMM slots
  • (1) PCI-E Gen.3 x16 slot, (1) PCI-E Gen.3 x8 OCP mezz. slot
  • (2) 1000BASE-T ports, (2) 1000BASE-T ports with shared IPMI   [Details...]

FT77B-B7059

Intel Xeon Phi Server

FT77B-B7059:
4U Server compatible Xeon Phi™ 7120P / 5110P / 3120P

  • Support Intel® Xeon® Processor E5-2600 v2 Series
  • LGA2011 Dual Sockets / Intel® C602 chipset
  • (12)+(12) DIMM slots, (10) 3.5"/2.5" HDD, (2) LAN ports
  • (8) PCI-E Gen3 x16 slots for Xeon Phi™ 7120P / 5110P / 3120P   [Details...]

TA77-B7061

Intel Xeon Phi Server

TA77-B7061:
2U Server compatible Xeon Phi™ 5110P

  • Support Intel® Xeon® Processor E5-2600 v2 Series
  • LGA2011 Dual Sockets / Intel® C602 chipset
  • (8)+(8) DIMM slots, (8) 2.5" Hot-Swap HDD, (2) GbE ports
  • (4) PCI-E Gen3 x16 slots for Xeon Phi™ 7120P / 5110P / 3120P   [Details...]

GA80-B7061

Intel Xeon Phi Server

GA80-B7061:
1U Server compatible Xeon Phi™ 3120A / Xeon Phi™ 5110P

  • Support Intel® Xeon® Processor E5-2600 V2 Series (Ivy Bridge-EP)
  • Dual LGA2011 Sockets / Intel® C602 chipset
  • (8)+(8) DIMM slots, (4) 2.5" Hot-Swap HDD, (2) GbE + (1) IPMI
  • (2) PCI-E Gen3 x 16 slots for Xeon Phi™ 3120A or Xeon Phi™ 5110P   [Details...]

FT77A-B7059-LE

Intel Xeon Phi Server

FT77A-B7059-LE:
4U Server compatible Xeon Phi™ 3120A

  • Support Intel® Xeon® Processor E5-2600 V2 Series (Ivy Bridge-EP)
  • Single LGA2011 Socket / Intel® C602 chipset
  • (12) DIMM slots, (4) 3.5" Hot-Swap HDD, (2) GbE
  • (4) PCI-E Gen3 x 16 slots for Xeon Phi™ 3120A  [Details...]

 

 

 

 

 

Intel® Xeon Phi ™ Intro

The Intel Xeon Phi Product Family **

Breakthrough Performance for Your Highly-Parallel Applications

Extracting extreme performance from highly-parallel applications just got easier. Intel® Xeon Phi™ coprocessors, based on Intel Many Integrated Core (MIC) architecture, complement the industry-leading performance and energy-efficiency of the Intel® Xeon® processor E5 family to enable dramatic performance gains for some of today's most demanding applications - up to 1.2 teraflops per coprocessor.1 You can now achieve optimized performance for even your most highly-parallel technical computing workloads, while maintaining a unified hardware and software environment.2

Even Higher Efficiency for Parallel Processing

While a majority of applications will continue to achieve maximum performance using Intel Xeon processors, certain highly-parallel applications will benefit dramatically by using Intel Xeon Phi coprocessors. Each coprocessor features many more and smaller cores, many more threads, and wider vector units. The high degree of parallelism compensates for the lower speed of each individual core to deliver higher aggregate performance for highly- parallel code.

You can use Intel Xeon processors and Intel Xeon Phi coprocessors together to optimize performance for almost any workload. To take full advantage of Intel Xeon Phi coprocessors, an application must scale well to over one- hundred threads, and either make extensive use of vectors or efficiently use more local memory bandwidth than is available on an Intel Xeon processor. Learn more...

A Single Programming Model for All Your Code

A broad ecosystem of programming languages, models, and tools support IntelR architecture and all of them can be used with both Intel Xeon processors and Intel Xeon Phi coprocessors. Applications that run on one processor family will run on the other. This uniformity can greatly reduce the complexity of software development. Existing applications will need to be tuned and recompiled to maximize throughput, but your developers won't need to rethink the entire problem or master new tools and programming models. Instead, they can reuse existing code and maintain a common code base using familiar tools and methods.

Code can be optimized just once for both Intel Xeon processors and Intel Xeon Phi coprocessors. The same techniques deliver optimal performance for both, so the investment you make in parallelizing your code will deliver benefits across the full range of computing environments.

A Family of Coprocessors for Diverse Needs

Intel Xeon Phi coprocessors provide up to 61 cores, 244 threads, and 1.2 teraflops of performance, and they come in a variety of configurations to address diverse hardware, software, workload, performance, and efficiency requirements. 1 They also come in a variety of form factors, including a standard PCIe* x16 form factor (with active, passive, or no thermal solution), and a dense form factor that offers additional design flexibility (Table below).

  • The Intel® Xeon Phi™ Coprocessor 3100 family provides outstanding parallel performance. It is an excellent choice for compute-bound workloads, such as MonteCarlo, Black-Scholes, HPL, LifeSc, and many others. Active and passive cooling options provide flexible support for a variety of server and workstation systems.
  • The Intel® Xeon Phi™ Coprocessor 5100 family is optimized for high-density computing and is well-suited for workloads that are memory-bandwidth bound, such as STREAM, memory-capacity bound, such as ray-tracing, or both, such as reverse time migration (RTM). These coprocessors are passively cooled and have the lowest thermal design power (TDP) of the Intel Xeon Phi product family


Intel® Xeon Phi™ Product Family Specifications

PRODUCT NUMBER FORM FACTOR &, THERMAL SOlUTION4 BOARD TDP (WATTS) NUMBER OF CORES FREQUENCY (GHz) PEAK DOUBLE PRECISION PERFORMANCE (GFLOP) PEAK MEMORY BANDWIDTH (GB/s) MEMORY CAPACITY (GB) INTEl TURBO BOOST TECHNOLOGY
3120A PCIe, Active 300 57 1.1 1003 240 6 N/A
5110P PCIe, Passive 225 60 1.053 1011 320 8 N/A

 

  • 1 Claim based on calculated theoretical peak double precision performance capability for a single coprocessor. 16 DP FLOPS/clock/core * 61 cores * 1.238 GHz = 1.208 TeraFlops.
  • 2 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to http://www.intel.com/performance
  • 4 Form factors and thermal solutions include: Standard x16 PCIe cards (PCIe), available with passive cooling (P), active cooling (A), or no thermal solution (NTS); and dense form factor (DFS) cards, which are a derivative of the standard PCIe form factor card and are designed for more customized implementations. Contact your Intel sales representative or your distributor for more information and the latest specifications
  • *Other names and brands may be claimed as the property of others.