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TYAN v141 2016 Aug Newsletter

  

Recap TYAN @ IDF16


  


TYAN exhibited its latest NVMe optimized server and storage platforms at IDF 2016 San Francisco. Featuring high IOPS (input/output operations per second) and storage density, TYAN delivers high performance with support for up to 4x NVMe in 1U GT62B-B5539, 1U GT62B-B7076 and 2U TN70B-B7086 storage platforms for enterprise, data center and cloud environment deployments. The 4U-quad-socket Intel® Xeon® processor E7-8800/4800 v3/v4-based FT76-B7922, targeting high performance computing market, was also displayed at IDF 2016.

In order to address data intensive workloads in need of higher performance for storage, TYAN takes full advantage of Intel® NVMe technology to highlight hybrid storage configurations. TYAN server solutions with NVMe support can not only boost storage performance over the PCIe interface but provide storage flexibility for customers through scale-out architecture.

TYAN’s GT62B-B5539 server platform features Intel® Xeon® processor D-1500, a low-power server SoC architecture, up to 16 cores, and 10x 2.5" hot-swap drive bays with support for four NVMe drives. The platform is designed to deliver the best balance of performance and power consumption for the storage market. Additionally, TYAN showcased Intel® Xeon® processor E5-2600 v3/v4-based storage platforms for the SMB, enterprise and private cloud segment-the TN70B-B7086 provides a cost-effective storage expansion with support for 6x standard PCI-E x8 slots and 12x 3.5"/2.5" hot-swap drive bays with 4 of the bays supporting NVMe drives. The GT62B-B7076 supports 10x 2.5" hot-swap drive bays with 4 of the bays supporting NVMe drives. Both TN70B-B7086 and GT62B-B7076 are equipped with OCP and storage mezzanine slots, which allows customers benefit from the maximum I/O flexibility.
  

GT62B-B5539 (BTO): 1U single-socket Intel Xeon processor D-1500 (SoC) based platform supports up to 4x DDR4-2400 DIMM slots, and 10x SFF, hot-swap SAS 12Gb/s devices. 4 of the SFF bays can support NVMe devices in premium configuration.


B5539G62BV6E4HR-D41-2T / B5539G62BV6E4HR-D41 / B5539G62BV6E4H-D41-2T / B5539G62BV6E4H-D41
  • Intel® Xeon® processor D-1541 SoC (System-on-a-Chip)
  • (4) DIMM slots
  • (2) 10GbE + (2) GbE + (1) PHY (dedicated for IPMI) (-2T SKU) or (2) GbE + (1) PHY (dedicated for IPMI)
  • OCP Mezz.
  • (6) hot-swap 2.5" HDD + (4) NVMe


TN70B-B7086: 2U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 16x DDR4-2400 DIMM slots, and 12x LFF/SFF, hot-swap SAS 12Gb/s devices. 4 of the LFF bays can support NVMe devices in premium configuration. There are additional 2x SFF internal drive seats for boot device installation.


B7086T70BV8E4HR / B7086T70BV12HR
  • (2) Intel® Xeon® E5-2600 v3/v4 Processors
  • Dual LGA2011 Socket / Intel® C612 chipset
  • (8+8) DDR4 DIMM slots
  • (3) GbE (shared IPMI NIC)
  • (2) PCI-E Gen.3 x16 + (2) PCI-E Gen.3 x8 or (6) PCI-E Gen.3 x8
  • (8) hot-swap 3.5"/2.5" HDD + (4) NVMe (-V8E4HR SKU) or (12) hot-swap 3.5"/2.5" HDD (-V12HR SKU)

     

GT62B-B7076: 1U dual-socket Intel Xeon processor E5-2600 v3/v4-based platform supports up to 16x DDR4-2400 DIMM slots, and 10x SFF, hot-swap SAS 12Gb/s devices. 4 of the SFF bays can support NVMe devices in premium configuration.


B7076G62BV10H / B7076G62BV10HR / B7076G62BV6E4HR
  • (2) Intel® Xeon® E5-2600 v3/v4 Processors
  • Dual LGA2011 Socket / Intel® C612 chipset
  • (8+8) DDR4 DIMM slots
  • (2) GbE ( shared IPMI NIC)
  • (2) PCI-E Gen.3 x8 + (1) OCP Mezz. + (1) SAS Mezz.
  • (6) hot-swap 2.5" HDD + (4) NVMe (-V6E4HR SKU) or (10) 2.5" hot-swap HDD (-V10H / -V10HR SKU)


FT76-B7922(BTO): 4U quad-socket Intel® Xeon® processor E7-8800/4800 v3/v4-based platform with support for up to 4 Intel® Xeon Phi™ coprocessor modules, 96x DDR4 DIMM slots, and up to 8x SFF, hot-swap SAS 12Gb/s devices.


B7922F76U8HR-4T-HE-X / B7922F76U8HR-2T / B7922F76U8HR-4T
  • (4) Intel® Xeon® E7-8800/E7-4800 v3/v4 Processors
  • (4) Intel® Xeon Phi™ coprocessors
  • (96) DDR4 DIMM slots
  • PCI-E Gen2 x8 / (2) hot-swap PCI-E Gen3 x8 / (10) PCI-E Gen3 x8
  • (2)10GbE or (4)10GbE + (1) IPMI
  • (8) hot-swap 2.5" HDDs



S5539 (BTO): Single-socket Intel Xeon processor D-1500-based server board in micro ATX (9.6" x 9.6") form factor for 1U or pedestal low-power storage server deployment.


S5539GM4NR-D41-2T / S5539GM2NR-D41 / S5539GM2NR-D31 / S5539GM2NR-D21
  • Intel® Xeon® processor D-1541 SoC
  • (4) UDIMM/RDIMM DDR4
  • PCI-E Gen2 x4 slot / (1) PCI-E Gen3 x8 slot / (2) mezz. slots
  • (2) GbE or (2) 10GbE + (2) GbE (-2T SKU)
  • (6) SATA 6Gb/s


S5542: Single-socket Intel® Xeon® processor E3-1200 v5-based server board in ATX (12" x 9.6") form factor for entry server deployment.


S5542WGM2NR / S5542GM2NR / S5542GM4NR / S5542G2NR-UHE / S5542G2NR-UHE-M2
  • Intel® Xeon® E3-1200 v5 processors
  • Single LGA1151 Socket / Intel C232 chipset, Intel C236 chipset (-UHE / -UHE-M2 SKU)
  • (4) DDR4 DIMM slots
  • PCI-E Gen.3 x1, (1) PCI-E Gen.3 x8 with x4 link, (1) PCI-E Gen.3 x16 with x8 link
  • (2) GbE (-2NR SKU) or (4) GbE (-4NR SKU)


S7086: Dual-socket Intel Xeon processor E5-2600 v3/v4-based server board in rack-optimized, EATX (12” x 13”) form factor for 2U full-featured server deployment.


S7086GM3NR / S7086GM3NRE
  • (2) Intel® Xeon® E5-2600 v3/v4 processors
  • Dual LGA2011 Sockets / Intel C612 chipset
  • (8+8) DDR4 DIMM slots
  • (2) in-lined PCI-E Gen.3 x16+x4 slots (each with x24 lanes), (1)PCI-E Gen.3 x8 SAS mezz. slot, (1)PCI-E Gen.3 x8 OCP mezz. slot
  • (3) GbE ports (1 port shared with IPMI)




 

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